PCIeChip

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    HIGH PERFORMANCE INDUSTRIAL 3D PCIeChip

    Industrial 3D PCIECHIP Features:

    • Solder to board, Castellated PCB Module
    • Capacities 128GB to 512GB
    • Compliant with PCI Gen3 & NVMe (ver. 1.4)
    • PCI Express Gen3 x2 Lanes Configuration
    • Advanced LDPC ECC
    • -40°C to +85°C Operating Temperature
    • Supports NVMe defined SMART attributes
    • DRAM-less, supports HBM
    • Native PCIe mode operation
    • 3,000G Operational Shock / 20G Operational Vibration
    • Talk to us to know more
    • 290PC Series

     

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Cactus Technologies Industrial 3D PCIeChip is an innovative embedded solution that provides high-performance, reliable, cost-effective flash storage in a solderable module. They are intended for applications that demand high performance in a rugged, small-footprint form factor that can withstand extreme shock and vibration.